教育背景
2007.09-2012.05 美国加州大学河滨分校,计算机工程专业,博士学位
2007.09-2008.12 美国加州大学河滨分校,计算机工程专业,硕士学位
2003.09-2007.06 华中科技大学,电子信息工程专业,学士学位
工作经历
2012.05-今 电子科技大学,任副教授
项目课题经历
论文、成果、著作等
1. H. Wang, X. Guo*, S. X.-D. Tan, C. Zhang, H. Tang, and Y. Yuan, “Leakage-aware predictive thermal management for multi-core systems using echo state network,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, 2019. (CCF A类期刊论文)(pdf)
2. H. Wang, D. Huang*, R. Liu, C. Zhang, H. Tang, and Y. Yuan, “STREAM: Stress and thermal aware reliability management for 3-D ICs,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, 2018. (CCF A类期刊论文)(pdf)
3. L. Zhang*, H. Wang, S. X.-D. Tan, "Fast Stress Analysis for Runtime Reliability Enhancement of 3D IC Using Artificial Neural Network", Proc. International Symposium on Quality Electronic Design (ISQED), San Jose, CA, Mar. 2016. (pdf)1. H. Wang, D. Tang*, M. Zhang*, S. X.-D. Tan, C. Zhang, H. Tang, and Y. Yuan, “GDP: A greedy based dynamic power budgeting method for multi/many-core systems in dark silicon,” IEEE Trans. on Computers, vol. 68, no. 4, pp. 526-541, April 2019. (CCF A类期刊论文)(pdf)
2. H. Wang, J. Wan*, S. X.-D. Tan, C. Zhang, H. Tang, Y. Yuan, K. Huang, and Z. Zhang, “A fast leakage-aware full-chip transient thermal estimation method,” IEEE Trans. on Computers, vol. 67, no. 5, pp. 617–630, May 2018. (CCF A类期刊论文)(pdf)
3. X. Guo*, H. Wang, C. Zhang, H. Tang, and Y. Yuan, “Leakage-Aware Thermal Management for Multi-Core Systems Using Piecewise Linear Model Based Predictive Control”, Asia and South Pacific Design Automation Conference, 2019. (最佳论文提名,CCF C类会议论文)(pdf)
4. H. Wang, J. Ma*, S. X.-D. Tan, C. Zhang, H. Tang, K. Huang, and Z. Zhang, “Hierarchical dynamic thermal management method for high-performance many-core microprocessors,” ACM Trans. on Design Automation of Electronics Systems, vol. 22, no. 1, pp. 1:1–1:21, July 2016. (CCF B类期刊论文)(pdf)
专利、著作版权等
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