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刘盼

领域:高端装备制造产业 学校:复旦大学职称:青年研究员


研究领域为预覆连接材料的功率电子封装基板制备
柔性基板的半导体器件制备与封装
第三代半导体模块封装可靠性测试
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具体了解该专家信息,请致电:027-87555799 邮箱 haizhi@uipplus.com

教育背景

工作经历

项目课题经历

论文、成果、著作等

产业化项目

预涂焊料的直接覆铜基板研发及初步量产 (2017年2月至2018年9月 项目经理)


学术论文

P. Liu, H. W. van Zeijl, M. R. Venkatesh, R. Sokolovskij, R. Kurt and G. Q. Zhang, "Review on retrofit G4 LED lamps: Technology, challenges, and future trends," 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2015, pp. 2277-2282.R Sokolovskij. 

P Liu, H W van Zeijl, B Mimoun, and G Q Zhang, “Design and fabrication of a foldable 3D silicon based package for solid state lighting applications”, Journal of Micromechanics and Microengineering, Volume 25, Number 5.

P. Liu, J. Zhang, R. Sokolovskij, H.W. Zeijl, B. Mimoun, G.Q. Zhang, “Geometric optimization of high performance interconnect of Rigid/Flexible/Rigid substrate for Wafer Level Packaging in Solid State Lighting applications by numerical simulations”. 1-6. 10.1109/EuroSimE.2013.6529982.

R Venkatesh, Manjunath & Liu, Pan & Zeijl, H.W. & Zhang, G.Q.. (2014). Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications. 1-6. 10.1109/EuroSimE.2014.6813865.

O. Isabella, P. Liu, B. Bolman, J. Krc, A. H. M. Smets and M. Zeman, "Modulated surface-textured substrates with high haze: From concept to application in thin-film silicon solar cells," 2011 37th IEEE Photovoltaic Specialists Conference, Seattle, WA, 2011, pp. 000616-000621.

专利、著作版权等

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