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董志刚

领域:高端装备制造产业 学校:大连理工大学职称:副教授

难加工材料高效加工技术与装备 精密/超精密加工技术与装备...

具体了解该专家信息,请致电:027-87555799 邮箱 haizhi@uipplus.com

教育背景

2002.9 2010.1 大连理工大学 机械制造及自动化 博士 1998.9 2002.7 大连理工大学 机械制造及其自动化 学士

工作经历

2015.12 至今 大连理工大学 副教授 2012.7 2015.12 大连理工大学 讲师 2010.6 2012.7 大连理工大学 师资博士后

项目课题经历

科研项目: [1] 国防基础科研核科学挑战专题课题:难加工金属材料微量去除调控方法和高精度高完整性表面加工方法,TZ2018006-0101-01。2018-2021。国防科工局,380万元。负责人。批准时间:2018-7-20。 [2] 航空发动机及燃气轮机重大专项子课题:XXX基础研究。149万元。负责人 [3] 民用飞机专项科研项目课题:爬行机器人制孔多功能末端执行器研制,112.80万元。2019-2021。负责人。 [4] 国家自然科学基金面上项目:GaN晶片的光电化学机械抛光新方法,51ᠦ୔

论文、成果、著作等

近5年代表性论文: [1] Zhigang Dong, Liwei Ou, Renke Kang, Huiqin Hu, Bi Zhang, Dongming Guo, Kang Shi. Photoelectrochemical mechanical polishing method for n-type gallium nitride. CIRP Annals - Manufacturing Technology, 2019, 68(1): 205-208. DOI: 10.1016/j.cirp.2019.04.121 [2] Zhigang Dong, Feifei Zheng, Xianglong Zhu, Renke Kang*, Bi Zhang, Zhiqiang Liu. Characterisation of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction. The International Journal of Advanced Manufacturing Technology, 2017, 93: 2827–2839. DOI 10.1007/s00170-017-0676-4. [3] Haijun Liu, Zhigang Dong*, Renke Kang, Ping Zhou, Shang Gao. Analysis of factors affecting gravity-induced deflection for large and thin wafers in flatness measurement using three-point-support method. Metrology and Measurement Systems, 2015, 22(4): 531-546. [4] Haijun Liu, Zhigang Dong*, Han Huang, Renke Kang, Ping Zhou. A new method for measuring the flatness of large and thin silicon substrates using a liquid immersion technique. Measurement Science and Technology, 2015, 26(11): 115008. [5] Jiansong Sun, Zhigang Dong, Xuanping Wang, Yidan Wang, Yan Qin, RenkeKang*. Simulation and experimental study of ultrasonic cutting for aluminum honeycomb by disc cutter. Ultrasonics, 2020, In Press. DOI: 10.1016/j.ultras.2020.106102 [6] Liwei Ou, Zhigang Dong, Renke Kang, Kang Shi*, Dongming Guo. Photoelectrochemically combined mechanical polishing of n-type gallium nitride wafer by using metal nanoparticles as photocathodes. International Journal of Advanced Manufacturing Technology, 2019, In press, DOI: 10.1007/s00170-018-03279-5 [7] Feifei Zheng, Zhigang Dong, Renke Kang*, Bi Zhang, Xianglong Zhu, Jinting Liu. Analysis of material removal behavior in ultrasonically assisted scratching of RB-SiC from energy aspects. International Journal of Advanced Manufacturing Technology, 2018, 98(9-12): 2257-2270. 10.1007/s00170-018-2256-7. [8] Yan Qin, Zhigang Dong, Renke Kang, Jie Yang*, Babajide O Ayinde. Detection of honeycomb cell walls from measurement data based on Harris corner detection algorithm. Measurement Science and Technology, 2018, 29: 065004(10pp). 10.1088/1361-6501/aab2e2 [9] Yuan Zhang, Renke Kang, Zhigang Dong*, Qing Wang, Xianglong Zhu, Rui Xu, Dongming Guo. Microstructural evolution of soft magnetic 49Fe-49Co-2V alloy induced by drilling. Materials & Design, 2020, 189: 108501. DOI: 10.1016/j.matdes.2020.108501 [10] Yan Bao, Renke Kang, Zhigang Dong*, Xianglong Zhu, Changrui Wang, Dongming Guo. Multi-point support technology for mirror-milling of aircraft skins. Materials and Manufacturing Processes, 2018, 33(9): 996-1002. 10.1080/10426914.2017.1388519. [11] Shang Gao, Zhigang Dong, Renke Kang, Bi Zhang, Dongming Guo. Warping of silicon wafers subjected to back-grinding process. Precision Engineering, 2015, 40: 87-93. [12] Ping Zhou, Zhigang Dong, Renke Kang, Zhuji Jin, Dongming Guo. A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing with double-layer structure of polishing pad. International Journal of Advanced Manufacturing Technology, 2015, 77(1-4): 107-116. [13] Yan Bao, Xianglong Zhu, Renke Kang, Zhigang Dong*, Bi Zhang, Dongming Guo. Optimization of support location in mirror-milling of aircraft skins. Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture, 2018, 232(9): 1569-1576. 10.1177/0954405416673110 [14] Yan Qin, Renke Kang, Zhigang Dong*, Yidan Wang, Jie Yang and Xianglong Zhu. Burr removal from measurement data of honeycomb core surface based on dimensionality reduction and regression analysis. Measurement Science and Technology, 2018, 29: 115010(11pp). 10.1088/1361-6501/aae1c4 [15] Yan Bao, Renke Kang, Zhigang Dong*, Xianglong Zhu, Changrui Wang, Dongming Guo. Model for surface topography prediction in mirror-milling of aircraft skin parts. The International Journal of Advanced Manufacturing Technology, 2018, 95(5), 2259-2268. DOI: 10.1007/s00170-017-1368-9. [16] Feifei Zheng, Renke Kang, Zhigang Dong*, Jiang Guo, Jinting Liu, Jiatong Zhang. A theoretical and experimental investigation on ultrasonic assisted grinding from the single-grain aspect. International Journal of Mechanical Sciences, 2018, 148: 667-675. 10.1016/j.ijmecsci.2018.09.026. [17] Liwei Ou, Yahui Wang, Huiqing Hu, Liangliang Zhang, Zhigang Dong*, Renke Kang, Dongming Guo, Kang Shi*. Photochemically combined mechanical polishing of N-type gallium nitride wafer in high efficiency. Precision Engineering, 2019, 55: 14-21. DOI: 10.1016/j.precisioneng.2018.08.002 [18] Yan Bao, Xianglong Zhu, Renke Kang, Zhigang Dong*, Bi Zhang, Dongming Guo. Optimization of support location in mirror-milling of aircraft skins. Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture, 2018, 232(9): 1569-1576. 10.1177/0954405416673110 [19] Haijun Liu, Xianglong Zhu, Renke Kang, Zhigang Dong*, Xiuyi Chen. Three-point-support method based on position determination of supports and wafers to eliminate gravity-induced deflection of wafers. Precision Engineering, 2016, 46: 339-348. [20] Xianglong Zhu, Xiuyi Chen, Haijun Liu, Renke Kang, Bi Zhang, Zhigang dong*. An empirical equation for prediction of silicon wafer deformation. Materials Research Express, 2017, 4: 065904. [21] 董志刚, 段佳冬, 康仁科, 朱祥龙, 郑非非. 超声辅助磨削硬脆材料芯棒直径预测模型[J]. 光学精密工程, 2017, 25(08): 2106-2112. [22] 张迅, 董志刚, 王毅丹, 宿增迪, 宋洪侠, 康仁科. Nomex蜂窝芯直刃尖刀超声切割表面微观形貌特征. 机械工程学报, 2017, 53(19): 90-99. [23] 孙健淞, 董志刚, 王毅丹, 刘津廷, 秦炎, 康仁科. 超声切割铝蜂窝试验研究. 机械工程学报, 2017, 53(19): 128-135. [24] 谢海龙, 董志刚, 康仁科, 杨国林, 许君, 郭东明. C/E复合材料螺旋铣孔切屑形状与切削温度研究. 北京航空航天大学学报, 2017(02): 328-334. [25] 郑非非, 董志刚, 张嘉桐, 刘津廷, 康仁科*. 超声振动对单颗金刚石工具划擦RB-SiC材料去除行为的影响[J]. 机械工程学报, 2019,55(01): 225-232. [26] 鲍岩, 董志刚, 朱祥龙, 王昌瑞, 郭东明, 康仁科. 蒙皮镜像铣削支撑技术的研究现状和发展趋势. 航空学报, 2018, 39(4): 021817. DOI: 10.7527/ s1000-6893.2017.21817 [27] 鲍岩, 朱祥龙, 董志刚*, 郭东明. 飞机蒙皮镜像铣加工稳定性分析. 航空学报, 2018,张园, 康仁科, 刘津廷, 张一鸣, 郑伟帅, 董志刚*. 超声振动辅助钻削技术综述. 机械工程学报, 2017, 53(19): 33-44. [28] 王毅丹, 王宣平, 康仁科, 孙健淞, 贾振元, 董志刚*. 直刃尖刀超声辅助切割Nomex蜂窝芯切削力分析. 机械工程学报, 2017, 53(19): 74-82.

专利、著作版权等

授权国际发明专利: [1] Renke Kang, Xianglong Zhu, Zhigang Dong, Guang Feng, Dongming Guo. Multifunctional substrate polishing and burnishing device and polishing and burinshing method thereof. Patent No.: US 9138855B2. 2015.9授权 授权中国发明专利: [1] 董志刚,康仁科,杨国林,ᠦ୔
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