2018年博士毕业于韩国光云大学电子工程系，

并留校任电子工学科研究教授。2014年-2018年兼职任韩国延世大学医学院研究助理。2018年9月受聘于江南大学物联网工程学院，并在南京大学电子科学与工程学院兼职从事博士后研究。获准博士提前毕业并留校任职研究教授，于同年9月被江南大学物联网工程学院聘用为副教授，进入顾晓峰教授团队工作

。于2019年获国自然青年基金和江苏省自然青年基金资助，入选江苏省双创项目。

梁峻阁博士在直博四年间以第一作者发表SCI论文9篇(含中科院一区SCI论文2篇、二区2篇)，以共同作者发表SCI论文10篇，梁峻阁博士目前主要研究方向包括传感器研发与敏感材料制备表征、射频集成无源器件设计与加工工艺、脑电生理信号分析与脑类手术决策等研究。代表性论文如下： [1]Liang, J. G., Wang, C., Yao, Z., Liu, M. Q., Kim, H. K., Oh, J. M., Kim, N. Y. Preparation of Ultrasensitive Humidity-Sensing Films by Aerosol Deposition. ACS Applied Materials and Interfaces, 2018, 10(1), 851–863. [2]Liang, J. G., Kim, E.-S., Wang, C., Cho, M.-Y., Oh, J.-M., Kim, N.-Y. Thickness Effects of Aerosol Deposited Hygroscopic Films on Ultra-Sensitive Humidity Sensors. Sensors and Actuators B: Chemical, 2018, 265, 632-643. [3]Liang, J. G., Wang, C., Kim, N.-Y. Implementation of Ultra-Wideband Bandpass Filter with Modularized Design Based on Synchronous-Quasi-Resonance and Double-Curved-Route. IET Microwaves, Antennas & Propagation, 2018, 11(2), 1–10. [4]Liang, J. G., Wang, C., Kim, N.-Y. Integrated Passive Device Fabricated and Chip-on-Board Packaged Filter Employing Mixed Electric–magnetic Coupling Scheme. IET Microwaves, Antennas & Propagation, 2018, 12(14), 2191-2198. [5]Liang, J. G., Wang, C., Kim, N. Y. Dual-Band Ultra-Wideband Bandpass Filter with Eight- Resonant Modes and Quad-Transmission Zeros Employing Synchronous-Quasi-Resonance. Radioengineering, 2017, 26(3), 713–720. [6]Liang, J. G., Lee, D., Kim, N. Y., Kim, H. D. Changes in functional brain network topology after successful and unsuccessful corpus callosotomy for Lennox-Gastaut Syndrome, Scientific Reports, 2018, 8(1), 3414. [7]Liang, J. G.#, Lee, D.#, Youn, S. E., Kim, N. Y., Kim, H. D. Electro. Network Effects of Corpus Callosotomy in Patients with Lennox–Gastaut Syndrome, Frontiers in Neurology, 2017, 8(456), 1-10. [8]Liang, J. G., Wang, C., Kim, N. Y.Compact and Highly Selective Dual/Triple-band BPF Using Folded T-shaped Resonators for S-band Application,Microwave and Optical Technology Letters,2016, 58(2), 312-319. [9]Liang, J. G., Kim, E. S., Wang, C., Youn. J. H., Park, M.C., Kim, N. Y.,An On-wafer Embedded Passive Device using Chip-in-substrate Packaging Technology,Microwave and Optical Technology Letters,2015, 57(9), 2060-2067.

拥有授权的韩国发明专利1项，正在申请的国内发明专利２项