部分研究项目：  
[1] 广东省重点领域研发计划项目：印刷OLED显示高精度喷墨打印设备研发及应用
[2] 国家重点研发计划项目：高性能印刷电子器件的高精度跨尺度喷印制造基础研究
[3] 自然科学基金面上项目：柔性电子卷到卷制造中异质结构可控转移与层合机理
[4] 科技支撑计划项目：无菌制剂机器人自动化生产线研制与应用
[5] 国家自然科学基金重点项目：大面积柔性电子曲面共形制造及智能蒙皮应用
[6] 国家重大科研仪器设备研制专项:高超音速流场实时精确测量系统的研制与应用
[7] 科技支撑计划项目：燃料电池膜电极（MEA）专用装备研发与示范
[8] 国家973计划项目：高密度倒装键合中多物理量协同控制机制与实现 
 
 
获得荣誉与奖励： 
[1] 2018年日内瓦国际发明展特别金奖
[2] 2017年国家技术进步奖二等奖
[3] 2016年湖南省科技进步一等奖
[4] 2016年武汉市“黄鹤英才（科技）计划”
[5] 2014年日内瓦国际发明展金奖
[6] 2013年国家技术发明奖二等奖
[7] 2011年湖北省技术发明奖一等奖
 
 
部分授权发明专利：  
申请国家发明专利100余项，已授权90余项，代表性授权专利如下：
[1]  陈建魁，尹周平，黄永安，等：一种多工位协同的柔性电子制备系统及方法. 中国, ZL201610181599.2
[2]  陈建魁，尹周平，黄永安，等：一种柔性电子制备、转移与封装系统及方法. 中国, ZL201610182059.6
[3]  陈建魁，黄永安，尹周平，等：一种具备电场自适应特性的柔性电子电喷印设备及其方法.中国, ZL201610814102.6
[4]  陈建魁，等：一种基于柔性传感器张力分布检测的纠偏器.中国, ZL201610806297.X
[5]    陈建魁，尹周平，黄永安等：一种适用于成卷柔性电子器件的逐片转移装置. 中国, ZL201510461370.X
[6]  陈建魁，黄永安，尹周平，等：一种用于柔性膜转移的多自由度机械手.中国, ZL201510071778.6
[7]  陈建魁，黄永安，等：一种面向柔性芯片的多顶针剥离装置及剥离方法.中国, ZL201510531234.3
[8]  陈建魁，尹周平，等：一种适用于芯片高效转移的倒装键合控制方法.中国, ZL201511002791.2
[9]  陈建魁，尹周平，等：一种用于RFID标签生产的基板输送控制方法.中国, ZL201410192379.0
[10] 陈建魁，尹周平，等：一种适用于RFID标签制备的卡片式喷印机.中国, ZL201410454933.8
[11] 陈建魁，黄永安，尹周平，等：一种面向卷到卷电喷打印过程的多物理量协同控制方法.中国, ZL201310728496.X
[12] 陈建魁，尹周平，等：一种适于柔性电子标签封装过程的多参数协同控制方法.中国, ZL201310565358.4
[13]  陈建魁，等：一种RFID天线毛刺和污点缺陷的视觉检测系统及方法.中国,ZL201310011252.X
[14]  陈建魁，黄永安，尹周平，等：一种微径丝或管的制备方法及装置.中国, ZL201310214980.0
[15] 陈建魁，黄永安，尹周平，等：一种面向芯片级器件的焊点制备方法和装置.中国, ZL201310210444.3
[16] 陈建魁，尹周平，熊有伦，等：一种同时具有纠偏和张力控制功能的浮辊系统.中国, ZL201310291568.9
[17] 陈建魁，尹周平，熊有伦，等：一种兼具张力控制的薄膜输送纠偏装置.中国, ZL201310291718.6
[18]  陈建魁，尹周平，熊有伦，等：一种用于柔性膜同步输送的夹持进给系统及其应用.中国, ZL201210123127.3
[19]  陈建魁，尹周平，熊有伦，等：一种用于制造片材与柔性薄膜复合叠层的热压设备.中国, ZL201210123186.0
[20]  陈建魁，尹周平，陶波，等：一种多层结构的柔性薄膜连的续层合方法及设备.中国, ZL201210123169.7
 
 
主要代表性著作：
[1]  JianKui Chen, Teng Liu, Hua Yang *, Zhou Zhang, YongAn Huang, ZhouPing Yin. Polygonal-feature-based shape context for flexible surface vision positioning. Measurement Science and Technology, 2019
[2]  Jiankui Chen, Xi Jiang, Wei Tang*, Liang Ma, Yiqun Li*, YongAn Huang and Zhouping Yin. Roll-to-roll stack and lamination of gas diffusion layer in multilayer structured membrane electrode assembly. Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture, 2019
[3]  Liang Ma, JianKui Chen*, Wei Tang, et al. Vibration-based estimation of tension for an axially travelling web in roll-to-roll manufacturing. Measurement Science and Technology, 2018
[4]  YongAn Huang , Huimin Liu, Zhoulong Xu , Jiankui Chen*, and Zhouping Yin. Conformal Peeling of Device-on-Substrate System in Flexible Electronic Assembly. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018
[5]  Wei Tang, JianKui Chen*, ZhouPing Yin. Elastic buckling analysis of webs transported through rollers with misalignment. Thin-Walled Structures, 2017
[6]  Liang Ma, JianKui Chen*, Wei Tang, et al. Transverse vibration and instability of axially travelling web subjected to non-homogeneous tension. International Journal of Mechanical Sciences, 2017
[7]  Liang Ma, JianKui Chen*, Wei Tang, et al. Free Vibration Analysis of an Axially Travelling Web with Intermediate Elastic Supports. Journal of Applied Mechanics, 2017
[8]  JinHua Hong, JianKui Chen*, ZhouLong Xu, ZhouPing Yin. Reliable thin chip peeling from adhesive tape with inverted needle ejecting and spring buffering. Journal of Adhesion Science and Technology. 2017
[9]  JinHua Hong, JianKui Chen*, ZhouLong Xu, ZhouPing Yin. High-efficiency Revolving-turret Chip Transferring Technology for Flip Chip Packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2017
[10] JianKui Chen, HuiMin Liu, YongAn Huang, et al. High-rate roll-to-roll stack and lamination of multilayer structured membrane electrode assembly. Journal of Manufacturing Processes, 2016
[11]JianKui Chen, ZhouLong Xu, YongAn Huang, et al. Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly. Science China Technological Sciences, 2016
[12]YuanQi Zeng, Bo Tao, JianKui Chen*, et al. Temperature-dependent orientation study of the initial growth of pentacene on amorphous SiO2, by molecular dynamics simulations. Journal of Crystal Growth, 2015
[13]HuiMin Liu, ZhouPing Yin, YongAn Huang, JianKui Chen*. Competing Fracture of Thin-Chip Transferring from/onto Prestrained Compliant Substrate. Journal of Applied Mechanics, 2015
[14]ZhouLong Xu, ZhouPing Yin, YongAn Huang, JianKui Chen*. Analytical Evaluation of Interfacial Crack Propagation in Vacuum-Based Picking-up Process. IEEE Transactions on Components Packaging & Manufacturing Technology, 2015
[15]XiaoMei Wang, ZhouPing Yin, YongAn Huang, JianKui Chen*. Highly sensitive, temperature-dependent gas sensor based on hierarchical ZnO nanorod arrays. Journal of Materials Chemistry C, 2015